The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT

This paper presents the effect of gap between Plastic Leaded Chip Carrier (PLCC)
by using three dimensional numerical analysis of heat and fluid flow in computer.
3D model of microprocessors is built using GAMBIT and simulated using FLUENT
software. The study was made for twomicroprocessors arranged in line under
different types of inlet velocities and package (chip) powers. The results are
presented in terms of average junction temperature and thermal resistance of each
package. The junction temperature is been observed and it was found that the
junction temperature of the microprocessors is not exceed 70º C. It also found that
the gap between PLCC play important rolesto control and manage the junction
temperature. The strength of CFD software in handling heat transfer problems is
proved to be excellent.