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Numerical investigation of heat transfer of twelve plastic leaded chip carrier (PLCC) by using computational fluid dynamic, FLUENT TM software


Citation

Mazlan Mohamed and A.Rahim and Muhamad Iqbal Ahmad and Abdullah Mohd Mustafa Al Bakri and Razak Wahab and H.M Nor Hakim (2013) Numerical investigation of heat transfer of twelve plastic leaded chip carrier (PLCC) by using computational fluid dynamic, FLUENT TM software. Advanced Materials Research, 795. pp. 603-610. ISSN 1662-8985

Abstract

Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to
tackle the thermal management issue of micro-electronic devices. In the present study, three
dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and
mounted horizontally on a printed circuit board, is carried out using a commercial CFD code,
FLUENTTM. The simulation is performed for 12 PLCC under different inlet velocities and chip
powers. The contours of average junction temperatures are obtained for each package under
different conditions. It is observed that the junction temperature of the packages decreases with
increase in inlet velocity and increases with chip power. Moreover, the increase in package density
significantly contributed to rise in temperature of chips. Thus the present simulation demonstrates
that the chip density (the number of packages mounted on a given area), chip power and the coolant
inlet velocity are strongly interconnected; hence their appropriate choice would be crucial

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Additional Metadata

Item Type: Non-Indexed Article
Collection Type: Institution
Date: 2013
Journal or Publication Title: Advanced Materials Research
ISSN: 1662-8985
Uncontrolled Keywords: Microprocessors - Thermal Management - Plastic Leaded Chip Carrier
Faculty/Centre/Office: Faculty of Earth Sciences
URI: http://discol.umk.edu.my/id/eprint/7870
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