Numerical investigation of heat transfer of twelve plastic leaded chip carrier (PLCC) by using computational fluid dynamic, FLUENT TM software

Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to
tackle the thermal management issue of micro-electronic devices. In the present study, three
dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and
mounted horizontally on a printed circuit board, is carried out using a commercial CFD code,
FLUENTTM. The simulation is performed for 12 PLCC under different inlet velocities and chip
powers. The contours of average junction temperatures are obtained for each package under
different conditions. It is observed that the junction temperature of the packages decreases with
increase in inlet velocity and increases with chip power. Moreover, the increase in package density
significantly contributed to rise in temperature of chips. Thus the present simulation demonstrates
that the chip density (the number of packages mounted on a given area), chip power and the coolant
inlet velocity are strongly interconnected; hence their appropriate choice would be crucial