Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT

This paper presents the thermal management of electronic components, microprocessor by
using three dimensional numerical analysis of heat and fluid flow in computer using CFD Software.
3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The
study was made for four microprocessors arranged in line under different thickness of thermal pad,
inlet velocities and package (chip) powers. The results are presented in terms of average junction
temperature of each package. It also found that the thickness of thermal pad, (chip) powers and inlet
velocities are the most important elements to control and manage the junction temperature. The
strength of CFD software in handling heat transfer problems is proved to be excellent.