The study of dispenser on LED encapsulation using computational fluid dynamics (CFD)

The purpose of this research study is to observe the effects of dispenser in the process of LED encapsulation using Computational Fluid Dynamics (CFD) and compare the effects of different dispenser parameters on the formation of micro voids in the encapsulation process. This study was aimed to observe a variety of dispenser parameters, which can significantly affect the formation of micro voids in the encapsulation process of LEDs. An LED’s performance is heavily impacted by the quality of its packaging. Any formation of micro voids during the encapsulation process of LED packaging can lead to various adverse effects such as the initiation and propagation of cracks. Consequently, this ends in the shortening of the LED’s product lifespan as the structural integrity of the packaging is damaged. Thus, this research would utilise ANSYS Fluent software to perform CFD simulation using epoxy resin, an 18G dispensing needle, and an LED5050 chip. By following the materials and measurements made during the physical experimentation setup, the 2D model would be created by using ANSYS Discovery and the analysis of the micro void formation is done using the Multiphase model of ANSYS Fluent CFD simulation. Additionally, the graphical results are interpreted referring to current journal studies.