Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering

Citation

M. S. Abdul Aziz and M. Z. Abdullah and C. Y. Khor and Z. M. Fairuz and Muhammad Iqbal Ahmad and Mazlan Mohamed and Mohd Sukhairi Mat Rasat (2014) Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering. Advances in Mechanical Engineering.

Abstract

An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the
effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board
model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37). In the analysis,
the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The
structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering
process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 <

Download File / URL

Full text not available from this repository.

Official URL: http://www.hindawi.com/journals/ame/2014/275735/

Additional Metadata

Item Type:	Indexed Article
Collection Type:	Institution
Date:	2014
Journal or Publication Title:	Advances in Mechanical Engineering
Faculty/Centre/Office:	Faculty of Earth Sciences
URI:	http://discol.umk.edu.my/id/eprint/7497
Statistic Details:	View Download Statistic

Edit Record (Admin Only)

View Item

The Office of Library and Knowledge Management, Universiti Malaysia Kelantan, 16300 Bachok, Kelantan.
Digital Special Collection (UMK Repository) supports OAI 2.0 with a base URL of http://discol.umk.edu.my/cgi/oai2