Investigating on the effects of LED design on microvoids formation

This study meticulously investigates how LED design parameters intricately influence microvoids formation during the encapsulation process. Through the integration of innovative computational methods and rigorous experimental validation, the research comprehensively analyzes various factors, encompassing chip size. Employing advanced Simulation techniques such as Computational Fluid Dynamics (CFD) and SolidWorks CAD for precise modeling, the study accurately simulates the intricate processes involved in LED encapsulation. Simultaneously, practical experiments faithfully replicate real-world conditions, fortifying the study's findings with robust empirical evidence. The objective is to unravel the intricate relationship between LED design nuances and the incidence of microvoids, with the overarching goal of providing invaluable insights to refine and optimize LED encapsulation techniques. By meticulously exploring the multifaceted factors that influence microvoids formation, this research endeavors to significantly enhance LED reliability and performance. The combined use of simulation and experimentation offers a holistic understanding of LED packaging dynamics. Furthermore, these findings are poised to revolutionize solid-state lighting technology, offering practical applications that will steer advancements in LED design and manufacturing processes.